Welcome to ICIII 2021
You are invited to attend the 2021 International Conference on Information Management, Innovation Management and Industrial Engineering (ICIII 2021), which will be held in Osaka International Convention Center, Osaka, Japan during September 16-18, 2021 It's co-organized by Science and Engineering Institute, USA, India International Congress on Computational Intelligence (IICCI).
It aims to serve as a major interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, concerns as well as practical challenges encountered and solutions adopted in the fields of Information Management, Innovation Management and Industrial Engineering, and to promote international academic exchange and international cooperation, provides an opportunity for researchers around the world to exchange ideas and latest research results. Keynote addresses, invited speeches, oral and poster sessions are included in the conference technical program that will feature state-of-the-art contributions in these fields.
Join us in Osaka, where exciting opportunities await you at our 2021 Annual Conference ICIII!
For pandemic or personal problems, if you cannot attend the conference, you can make online presentation. These papers can be published in conference proceedings on time and enjoy special registration rate. You can get more information here.
Submitted paper will be peer reviewed by conference committees, and accepted papers will be included into ICIII 2021 Conference Proceedings by Conference Publishing Services (CPS) and will be submitted for inclusion in IEEE Xplore.
- Submission Deadline: June 20, 2021
- Notification Date: July 10, 2021
- Registration Deadline: July 25, 2021
- Camera-Ready Due: July 30, 2021
- Conference Dates: September 16-18, 2021
- Please submit your full paper by Electronic Submission System( .pdf) (Template Download)
- For paper presentation only, please submit abstract. (Template Download)
- Listener Registration - Click -
- Any inquiry about the submission and conference, please free to contact firstname.lastname@example.org
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